Epson programmable crystal oscillator SG-8101CA, number X1G005571018300

Jul 08,2024
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Epson crystal oscillators, SMT crystal oscillators, SG-8101CA crystal oscillators, low jitter EPSON programmable crystal oscillators, quartz crystal oscillators are designed to match various models of ICs and other related technologies. The use of IC and chip design matching technology is a technical challenge that must be solved in the development and production process of high-frequency oscillators. In the design process, in addition to considering the electrical properties of quartz crystal resonators, the electrode design of quartz crystal oscillators also has its unique characteristics. It is necessary to consider the supply voltage, starting voltage, product rise time, fall time and other related parameters of the oscillator. SMT quartz crystal oscillator with low voltage startup power and multiple voltage options, such as 1.8V, 2.5V, 3.3V, 3.8V, 5V, etc. The product is widely used in tablet laptops, GPS systems, fiber channel, Gigabit Ethernet, serial ATA, serial connection to SCS1, PCI-Express SDH/SONET transmission base stations, and other fields. It complies with RoHS/lead-free

Voltage control pin. Voltage changes can cause a change in the frequency of a quartz crystal oscillator. Three state control feet. Usually, it is a three state control foot. Or suspended in the air. Grounding feet. Output pin. Suspended. (Under normal circumstances, it can also be used as a three state control foot when suspended.). Power voltage pin: High level (1): At this time, the 0SC active crystal oscillator has waveform output. Low level (0): At this time, the 0SC active crystal oscillator has no waveform output. Suspended: At this time, the 0SC active crystal oscillator has waveform output. Three states at the output end: There are three states at the output end; Waveform output: high level or suspended. No output waveform: low level. High resistance state (high impedance): When the output is low level, the output is high resistance state.

Impact during automatic installation, Epson crystal oscillator, SMT crystal oscillator, SG-8101CA crystal oscillator, low jitter EPSON programmable crystal oscillator

The impact caused by automatic installation and vacuuming can damage product characteristics and affect these products. Please set installation conditions to minimize impact as much as possible and ensure that there is no impact on product characteristics before installation. When the conditions change, please recheck the installation conditions. Meanwhile, before and after installation, please ensure that the crystal product does not collide with the machine or other circuit boards.

Notes for each packaging type

(1) Ceramic packaging products and SON products

After welding ceramic packaging products and SON products (MC-146, RTC ***** NB, RX - * * * NB), bent circuit boards may experience peeling or packaging splitting (cracking) due to mechanical stress on the welded parts. Especially when cutting circuit boards after welding these products, it is important to ensure that the product is laid out in positions with lower stress and to use cutting methods with lower stress.

Ceramic packaging products

When soldering ceramic packaging products on a circuit board (epoxy glass) with different expansion coefficients, repeated temperature changes over a long period of time may cause the terminal welding part to break. Please check the welding characteristics in advance.

(2) Ceramic packaging products

(3) Cylindrical products

Directly bending or forcefully stretching the pins on the glass part of the product can cause the sealing glass to split (crack) at the root of the pins, and may also damage the airtightness and product characteristics. When the pins of a crystal product need to be bent into the shape shown in the figure below, a 0.5mm pin should be left in this scenario and held to prevent splitting. When the pin needs to be repaired, do not stretch it and hold the bent part for correction. Applying a certain amount of pressure to the sealing part will cause damage to the airtightness. So please do not apply pressure here. In addition, to avoid pin fatigue cutting caused by negative machine resonance, it is recommended to use adhesive to fix the product on the fixed circuit board.

Installation Example

(4) DIP products

Deformed pins cannot be inserted into the board holes. Do not apply excessive pressure to avoid pin deformation. (5) SOJ and SOP products

Do not apply excessive pressure to avoid pin deformation. Welding deformed pins can cause floating. Especially SOP products require more careful handling. Epson crystal oscillator, SMT crystal oscillator, SG-8101CA crystal oscillator, low jitter EPSON programmable crystal oscillator