The clock module RA8000CE, which meets the vehicle certification standard of AEC-Q100, has been launched and supports synchronous interconnection of clock signals from multiple computing chips

Apr 11,2024
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At present, with the development of new energy vehicles, the updating and iteration of on-board electronics are accelerating, which has raised the design requirements of electronic control systems. For different in vehicle electronic components, such as ABS, TCS, and other systems closely related to automotive safety, a comprehensive chassis control system cannot be formed without the precise and reliable design of the electronic system time. Therefore, it is necessary to select clock modules that meet the vehicle specifications to assist in the design.

Figure 1 Chassis Control System in Cars

For electronic systems in cars that require time synchronization, a clock module with 1C bus can be used to interconnect clock signals to support communication between multiple computing chips. At present, EPSON has launched a real-time clock module RA8000CE that supports the IC bus. This clock module is stable and reliable, meeting the AEC-Q100 vehicle certification standards, and can help automotive electronics manufacturers design more modern electronic systems, which is trustworthy for users.

Figure 2 Structural Block Diagram of RA8000CE

The core components of automobiles are gradually shifting towards intelligence and electronics. Compared to traditional hydraulic and mechanical systems, in vehicle electronics can control the overall situation and provide more operational data for drivers to understand the operating status of the car. However, the accompanying demand is for strict time synchronization of data from different components to ensure real-time and accurate data, in order to maximize the safety of modern car operation. As a highly integrated chip, RA8000CE's 12C bus interface can achieve signal interconnection between computing chips. When applied to automotive electronics, it can achieve clock signal synchronization among multiple chips within the component and signal synchronization between multiple components.